Changing Computer Using Experience Intel Introduce Haswell in 2013

After Ivy Bridge Intel introduce next generation Haswell processor for billion of personal computer users. We already knew that the 22nm platform would offer a 30 percent power savings over Sandy Bridge, and now the company has let loose a few more details: Haswell is going to use transactional memory, which Intel is calling Transactional Synchronization Extensions (TSX), to allow high performance on multicore processors while keeping the programming familiar for developers. As explained in an Intel blog post, without TSX the system locks shared resources when they're modified by a thread and prevents other threads from making changes until the lock is disengaged.
The problem is that multiple threads could safely work at the same time as long as they didn't overlap, but in order to keep programming efficient (and easier to troubleshoot), locks cover large areas.

The Haswell processor will still be manufactured in 22 nm process, which confirms the fact that Intel is not going to reach 14 nm processor manufacturing during the next year.

Intel’s new platform will most likely be the first DDR4 personal computing platform available on a large scale. The fastest DDR4 memory modules supported will be running at a modest 2133 MHz.

We’re calling 2133 MHz modest because many memory manufactures have announced weeks – if not months – ago DDR3 modules certified to work at 3 GHz using overclocking settings.

The company has always been conservative about the memory frequencies supported by its chipsets, so the Haswell-EP platforms will be no different this time.

Intel explains that with TSX multiple threads are allowed to work concurrently where they weren't before, so long as they don't attempt to access or modify the same resources at the same time — if they do, a locking system will be implemented, and one process will happen after the other. According to the company, this will increase performance (as fewer operations will have to be delayed due to locks) while working in a way that developers are already comfortable with. If you're worried about compatibility, you'll be glad to hear that Intel's first implementation of TSX will play nice with the traditional locking method if you're not on a Haswell chip.


New Haswell processors will have two or four x86-cores with new microarchitecture featuring new AVX2 instructions and supporting Hyper-Threading technology. New Denlow graphics core in the new processors will exist in three modifications with different performance and will support DirectX 11.1 and OpenGL 3.2. The changes are expected to also touch upon the cache-memory architecture, which size will increase significantly: to 1 MB L2 per core and to 16 MB of shared L3 cache. The chips TDP will again be lowered and depending on the modification it will either fall into the 15-57 W range for mobile products or 35-95 W range for desktop processors.

Desktop Haswell platform will use new socket LGA 1150. The chipsets for upcoming processors will have native USB 3.0 and Thunderbolt support.

Intel Launches Haswell Processors in April 2013

Confirmed new features

• Haswell New Instructions (includes Advanced Vector Extensions 2 (AVX2), gather, bit manipulation, and FMA3 support).
• New sockets — LGA 1150 for desktops and rPGA947 & BGA1364 for the mobile market.
• Intel Transactional Synchronization Extensions (TSX).
• Graphics support in hardware for Direct3D 11.1 and OpenGL 3.2.
• DDR4 for the enterprise/server variant (Haswell-EX).

 

Expected features

• Shrink PCH from 65 nm to 32 nm.
• A new cache design.
• 128KB(64kB Instruction + 64KB Data, 2 cycle) L1 cache and 1MB L2 cache(6 cycle) per core.^{[citation needed]}
• Up to 32MB Unified cache LLC (Last Level Cache).
• Support for Thunderbolt technology.
• There will be three versions of the integrated GPU: GT1, GT2, and GT3. According to vr-zone, the fastest version (GT3) will have 20 execution units (EU).Another source, SemiAccurate, however says that the GT3 will have 40 EUs with an accompanying 64MB cache on an interposer. An additional source, AnandTech, agrees that GT3 will have 40 EUs, but makes no mention of an interposer. Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs.
• New advanced power-saving system.
• Base clock (BClk) increase to 266 MHz.
• 128 bytes cache line.
• Execution trace cache will be included L2 caching design.
• Fully integrated voltage regulator, thereby moving a component from the motherboard onto the CPU.
• 37, 47, 57W thermal design power (TDP) mobile processors.
• 35, 45, 55, 65, 77, and ~100W+ (high-end) TDP desktop processors.
• 10W TDP processors for the Ultra book platform (multi-chip package like Westmere). 
• Intel is developing a 10W TDP processor for even greater battery life, reduced heat which leads to thinner as well as lighter Ultrabooks. Due to reduced Watt-usage the performance level won't be as strong as from the Ivy-bridge cpu at 17W.